The electroplating process is to provide the metal coating with high conductivity, good solderability, high mechanical strength, and ductility to withstand the terminal panels of the component and to fill the plated-through holes from the circuit board surface.
On printed circuit boards, copper is used to interconnect the components on the board. Although it is a good conductor material for forming the conductive path board pattern on a printed circuit board, copper is also exposed if exposed to the air for extended periods of time It is easily tarnished by oxidation and loses its weldability due to corrosion. Therefore, a variety of technologies must be used to protect copper traces, vias, and plated-through vias. These technologies include organic coatings, oxide films, and plating techniques