Manufacturing-Ready AI Server PCBs

As AI servers and high-performance computing (HPC) platforms continue to evolve, core boards such as server motherboards and GPU/AI accelerator cards impose increasingly stringent technical challenges on AI server PCBs in terms of high-frequency and high-speed signal integrity and power integrity control, high layer-count and high-density interconnect (HDI) implementation, thermal and power management capability, as well as long-term 24/7 operational reliability.

Amidst this trend. We're honored to see an increasing number of clients in AI field reaching out to us for PCB supplies. We truly appreciate their trust and look forward to continuing to support innovation together.

To meet the stringent manufacturing requirements of AI servers in terms of high-frequency and high-speed signal integrity (SI), power integrity (PI), high layer-count high-density interconnect (HDI) structures, and long-term 24/7 operational reliability, we have completed the deployment of critical core equipment and process capabilities dedicated to AI server PCBs in our newly established facility.

The factory is equipped with 30 high-precision laser drilling machines for the consistent fabrication of microvia interconnect structures; fine-line etching production lines capable of achieving a minimum line width / line spacing of 40 μm; and advanced electroplating lines with stable and well-controlled plating thickness uniformity, maintaining thickness deviation within ±0.5 μm. In addition, industry-leading high-precision lamination equipment has been introduced to ensure layer-to-layer registration accuracy and long-term structural reliability for high-layer-count multilayer boards.

At present, the facility, production equipment, and engineering teams are fully in place, and our manufacturing and engineering capabilities are ready to support AI server PCB prototype introduction, validation, and subsequent high-volume production delivery.

As an AI Server PCB Manufacturer, HoYoGo has strengthened its core PCB manufacturing capabilities and has newly established a small- to medium-batch PCBA assembly line, forming a delivery model where PCB fabrication is primary and PCBA assembly serves as a complementary capability to support prototype validation and the transition into volume production for AI server projects. We are certified to ISO 9001, ISO 14001, ISO 13485, and IATF 16949, and all products are inspected in accordance with IPC-A-600H and IPC-6012 standards. For PCB fabrication or PCBA assembly quotations related to AI server boards (including UBBs, accelerator cards, power boards, CPU motherboards, and more) as well as HPC applications, please feel free to contact us.

Learn more about our AI Server PCB manufacturing capabilities.