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The purpose of the solder mask is to prevent conductor from being stained with tin, prevent short circuits between conductors caused by moisture, chemicals, etc., prevent circuit...

PCB pulse plating not only significantly improved the quality and in productivity efficient of common multilayer board, but also an indispensable and important method in blind vi...

In PCB factories, hole metalization usually consists of 8~9 steps of chemical working fluid treatment to complete the entire process. For each technology condition control of eac...

Whatever it is a 3 layer flexible copper clad laminate or 2 layer flexible copper clad laminate, there are three main manufacturing technologies. Each FCCL manufacturer will...

FPC is the abbreviation of Flexible Printed Circuit, which is widely popular for its lightness, thinness and flexibility and other characteristics. It uses various materials...

In the PCB manufacturing process, the lamination technology is the most important step. Some quality defects may occur during this process, which will affect the quality of the f...

Due to the miniaturization and lightweight of electronic products, the transformation of electronic components from plug-in components to chip components has been promoted,there ...

DPC(Direct Plating Copper) technology and DBC(Direct Bond Copper) technology are two commonly used ceramic substrate manufacturing technologies. While they are both method for ma...

The basic material of PCB board is called base material, also called copper clad laminate. Components will generate heat when working, so the material of the PCB board must have ...

With the continuous growth of global demand for new energy and the transformation of the energy structure, the market size of energy storage technology continues to expand. As an...