Automotive PCB ; IPC-6012 Class 3 ; Layer: 2L ; Base Material: FR4 TG150 ; Board Thickness: 1.6mm ; Final Copper Thickness: 2OZ ; Surface Finished: HASL Lead Free ; Unit Size(mm): 95.07*105.07 ; Panel Size(mm): 228.0*189.0 ; Min W/S(mil): 8/8 ; Min Hole Size: 0.25mm ; Tin Thickness: 2-40um ; Solder ...
https://www.hoyogo.com/Products/Automotive-PCB.htmlLayer : 2L ; Base Material : FR4 TG150 ; Board Thickness : 0.8mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 20.5*23.5 ; Panel Size(mm) : 179.8*248.5 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 19.7 ;
https://www.hoyogo.com/Products/HYG528R02112A.htmlLayer : 2L Base Material : PI 50um Board Thickness : 0.12±0.03mm Final Copper Thickness: Min 15um Surface Finished: ENIG Unit Size(mm) : 2.0*18.7 Panel Size(mm) : 35.0*58.0 Min Hole Copper Thickness : 12um Min W/S(mil) : 3.94/3.94 Solder Mask Color : green Coverlay: yellow
https://www.hoyogo.com/Products/Thin PCBHYG306F02018A.htmlLayer : 2L ; Base Material : PI 50um ; Board Thickness : 0.12±0.03mm ; Final Copper Thickness: Min 15um ; Surface Finished: ENIG ; Unit Size(mm) : 2.45*5.82 ; Panel Size(mm) : 58.0*246.2 ; Min Hole Copper Thickness : 12um ; Min W/S(mil) : 3.94/3.94 ; Solder Mask Color : green ; Coverlay: yellow ;
https://www.hoyogo.com/Products/LongThinPCBHYG306F02.htmlLayer : 10L ; Base Material : FR4 TG150 ; Stack-Up : 2 Step(2+6+2) ; Board Thickness : 0.8mm ; Surface Finished : ENIG+OSP ; Min Hole Size : 0.1mm ; Application : Intelligent Mobile Phone ;
https://www.hoyogo.com/Products/10LHDIPCB.htmlLayer : 4L ; Base Material : FR4 ; Stack-Up : 1 Step(1+2+1) ; Board Thickness : 1.6mm ; Surface Finished : ENIG+ Edge Plating ; Min Hole Size : 0.15mm ;
https://www.hoyogo.com/Products/PCBEdgePlating.htmlLayer : 6L ; Base Material : FR4 ; Stack-Up : 1 Step(1+4+1) ; Board Thickness : 1.2mm ; Surface Finished : ENIG ; Min Hole Size : 0.15mm ; Application : Communication ;
https://www.hoyogo.com/Products/Communication.htmlLayer : 6L ; Base Material : FR4 TG150 ; Stack-Up : 1 Step(1+4+1) ; Board Thickness : 1.0mm ; Surface Finished : ENIG+OSP ; Min Hole Size : 0.1mm ; Application : Intelegent Mobile Phone ;
https://www.hoyogo.com/Products/HDIPCB.htmlLayer : 4L ; Base Material : FR4 TG150 ; Stack-Up : 1 Step(1+2+1) ; Board Thickness : 0.8mm ; Surface Finished : ENIG+OSP ; Min Hole Size : 0.1mm ; Application : Intelligent Mobile Phone ;
https://www.hoyogo.com/Products/HDIPCB2.htmlLayer: 1L ; Base Material: ALU ; Board Thickness: 0.8mm ; Final Copper Thickness: 1oz ; Surface Finished : HASL Lead Free ; Unit Size(mm):366.0*100.9 ; Solder Mask: White ;
https://www.hoyogo.com/Products/AlubasePCBHYG308A010.htmlLayer : 2L ; Base Material : Alu 2W/MK ; Board Thickness : 1.6mm ; Surface Finished : ENIG ; Special Process : High Precision Engraving ; Illustration : Industry Control ;
https://www.hoyogo.com/Products/HighPrecisionEngravingPCB.htmlLayer : 1L ; Base Material : Alu 2W/MK ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 25.84*25.75 ; Panel Size(mm) : 136.0*164.0 ; Solder Mask : Black ;
https://www.hoyogo.com/Products/HYG709R01006A.htmlLed PCB ; Layer : 1L ; Base Material : ALU 1.0W/MK ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 28.0*22.2 ; Panel Size(mm) : 66.0*110.0 ; Solder Mask : White ; Application : Led ;
https://www.hoyogo.com/Products/HYG709A01046ALedPCB.htmlLayer : 12L ; Base Material : FR4 ; Board Thickness : 1.8mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 50.8*50.8 ; Panel Size(mm) : 114.3*167.64 ; Min W/S(mil) : 5/5 ; Min Hole Size : 0.2mm ; Solder Mask : Blue ; Special Request : Impedance Control+BGA ;
https://www.hoyogo.com/Products/HYG882R12023A.htmlLayer : 8L ; Base Material : FR4 ; Stack-Up : 2 Step(2+4+2) ; Board Thickness : 1.6mm ; Surface Finished : ENIG ; Min Hole Size : 0.15mm ; Application : Industrial instrument ;
https://www.hoyogo.com/Products/8LHDIPCB.html;
https://www.hoyogo.com/Products/4l-FR4rigidpcb.htmlLayer : 2L ; Base Material : FR-4 TG130 ; Board Thickness : 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 53*137 ; Peelable Mask(high temperature tape on the bottom) ;
https://www.hoyogo.com/Products/RigidPCBHYG528R02207.htmlLayer : 2L with NPTH ; Base Material : CEM3(R-1787) CTI≥600 ; Board Thickness : 1mm ; Final Copper Thickness : 1OZ ; Surface Finished : OSP ; Unit Size(mm) : 157.99*157.99 ; Panel Size(mm) : 170.43*508.0 ; Min W/S(mil) : 16/10 ; Solder Mask : White ; Special Process : Plate Bending&Twist 0.7% ; Sold...
https://www.hoyogo.com/Products/HYG528R02386A.htmlAutomotive PCB ; Solder Mask : Gray ; Layer : 2L ; Base Material : FR4 TG150 ; Board Thickness : 1.6mm ; Final Copper Thickness : 70UM ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 95.13*16.00 ; Panel Size(mm) : 303.4*199.0 ; Min W/S(mil) : 39.4/15.6 ; Min Hole Size : 0.4mm ;
https://www.hoyogo.com/Products/HYG711R02002A.htmlLayer : 6L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Surface Finished : ENIG ; Min Hole Size : 0.2mm ; Solder Mask : Pink ;
https://www.hoyogo.com/Products/PinkSolderMaskPCB.htmlRigid-Flex PCB ; Layer: 4L ; Base Material: FR4 TG150+PI ; Rigid Board Thickness: 0.7mm ; Flex Board Thickness : 0.15mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 19.0*154.3 ; Panel Size(mm): 114.0*196.0 ; Min W/S(mil): 5.9/5.9 ; Min Hole Size: 0.15mm ;
https://www.hoyogo.com/Products/HYG1103RF04002B.htmlLayer : 2L ; Base Material : 50UM PI+Stiffener ; Board Thickness : 0.325mm ; Final Copper Thickness : 1.5OZ ; Surface Finished : Immersion Tin ; Min W/S(mil) : 7.9/8.32 ; Unit Size(mm) : 27.00*107.35 ; Panel Size(mm) : 131.35*142.15 ;
https://www.hoyogo.com/Products/HYG528R02383A.htmlLayer : 6L ; Base Material+Stack-up : FR4+PI ; Board Thickness : 1.6mm+0.4mm ; Surface Finished : ENIG+Gold Finger ; Min Hole Size : 0.25mm ; Illustration : Industry Control ;
https://www.hoyogo.com/Products/RigidFlexPCB.htmlLayer : 4L ; Base Material : FR4 TG150+PI ; Board Thickness : 0.7mm ; Final Copper Thickness : 1OZ ; Surface Finished: ENIG ; Unit Size(mm) : 19.0*154.28 ; Panel Size(mm) : 114.0*196.0 ; Min hole size : 0.2mm ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 10/7 ;
https://www.hoyogo.com/Products/R-FPCBHYG1103RF04002.htmlLayer: 6L ; Base Material: FR4(TG170)+PI ; Board Thickness: 1.08mm ; Final Copper Thickness: 1oz ; Surface Finished: ENIG ; Unit Size(mm):140.0*50.0 ; Panel Size(mm):140.0*200.0 ; Min Hole Size : 0.12mm ; Min Hole Copper Thickness : 20um ; Min W/S(mil): 3.94/3.94 ; Solder Mask: green ; Coverlay: ye...
https://www.hoyogo.com/Products/rigid-flexPCBHYG306R.html;
https://www.hoyogo.com/Products/rigid-flexpcb.html;
https://www.hoyogo.com/Products/4L-FlexRigid-flexPCB.html;
https://www.hoyogo.com/Products/5L-FR4PIFlexpcb.htmlLayer: 6L Base Material: FR4 Board Thickness: 1.55mm Final Copper Thickness: 2OZ Surface Finished: ENIG+Gold Finger Unit Size(mm): 131.0*68.9 Panel Size(mm): 151.0*139.8 Min W/S(mil): 5.9/5.9 Min Hole Size: 0.2mm Special Request: BGA
https://www.hoyogo.com/Gold-Finger-PCB.htmlSolder Mask: Pink Layer: 2L Base Material: FR4 Board Thickness: 1.6mm Final Copper Thickness: 1OZ Surface Finished: HASL Lead Free Unit Size(mm): 160.0*100.0
https://www.hoyogo.com/Pink-PCB.html